August 30, 2022
Watch as TE Connectivity’s panel of experts share insights into overcoming smart IoT device miniaturization challenges associated with antennas, PCB connectors and components.
The integration of multiple wireless technologies into smart IoT devices presents unique challenges for manufacturers, given environmental requirements such as the need to be waterproof and withstand high temperatures, shock and vibration.
Rugged and robust designs, miniaturization, long battery life and high performance are all critical factors that allow these devices to deliver reliable, seamless connectivity.
Join the panel of experts as they take a closer look into challenges related to miniaturization and design considerations for overcoming them with a focus on antenna design, PCB connectors and associated components.
Register to watch HERE.